HOME|PRODUCTS|PKG Substrate|Core Technology

PRODUCTS

Core Technology

Worldwide Unique and High Productive Reel to Reel Process

    Substrate for next generation package
  • Continuous process for high throughput.
  • Uniform thermal and strain control can make flat substrate without warpage.
  • Easier method to transfer thinner substrate than 0.1mm thick.
  • Matured lamination technology for multi-layer substrate.

Process

3 layer thin substrate (0.1mm thick)

Etching technology

60㎛ PITCH Normal Fine Etching
Top 25 ㎛ 32 ㎛
Bottom 33 ㎛ 32 ㎛
Space 28 ㎛ 27 ㎛
Etching Factor 3.5 14

Widen Strip size