HAESUNG DS

Connecting the future at the peak of technology.

Connecting the Future at the Pinnacle of Technology.

ABOUT US

HAESUNG DS is at the
starting point of semiconductors
that connect the world.

Haesung DS is at the forefront of semiconductors that connect the world.

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Haesung DS Wins a gold prize at the ‘2024 LACP Spotlight Awards’

NEWS

Haesung DS Wins a gold prize at the ‘2024 LACP Spotlight Awards’

  Global Recognition for Its 2023 Sustainability Management Report   Haesung DS announced that its 2023 Sustainability Management Report has won the Gold Award at the prestigious 2024 Spotlight Awards organized by the League of American Communications Professionals (LACP).   Established in 2001, LACP is a globally renowned marketing research organization in the field of communications. Every year, it evaluates more than 1,000 annual and sustainability reports fr|om over 20 countries. Reports are assessed based on six key criteria, with awards categorized as Platinum (Grand Prize), Gold, Silver, and Bronze based on overall scores. This year, around 500 companies fr|om 20 countries participated in the competition.   Despite being Haesung DS’s first report, the 2023 Sustainability Management Report achieved an impressive score of 98 points, earning a Gold Award. The report received perfect scores in key areas, including First Impression, Overall Narrative, Overall Visual Design, and Perceived Relevance, demonstrating its exceptional quality and authenticity.   The report outlines Haesung DS’s sustainability initiatives across Environmental, Social, and Governance (ESG) dimensions. It incorporates the results of the company’s first-ever double materiality assessment and highlights its ESG vision, “A Sustainable Partner for the Environment, People, and Future.” The report also details Haesung DS’s ESG management framework, strategic goals, and future plans.   “Winning this award for our very first report is a testament to the sincerity of our ESG management efforts.” A representative fr|om Haesung DS stated, “This recognition motivates us to further enhance our ESG initiatives and solidify our position as a global leader in sustainable management.”   This accolade marks a significant milestone for Haesung DS as it continues its journey toward fostering sustainability and innovation across its operations.  

calendar_month2024.12.09

Haesung DS Develops Super-Fine Pitch Stamped QFP Tools with ILP 110㎛

NEWS

Haesung DS Develops Super-Fine Pitch Stamped QFP Tools with ILP 110㎛

  Haesung DS, the specialist of package substrate for semiconductor, announced its successful development of the Super-Fine pitch Stamped QFP (Quad Flat Package) tools featuring an inner lead pitch (*ILP) 110㎛, surpassing the current industry standard of ILP 130㎛.   This latest innovation has been recognized as a significant technological advancement in the Fine Pitch QFP sector. It is expected to bolster Haesung DS’s competitive edge and facilitate its entry into new markets.   The ongoing trend in the semiconductor industry toward higher integration and enhanced performance has heightened the importance of lead frame precision and quality. In this context, ILP plays a pivotal role, as narrower pitches allow for a greater number of leads within a single package, enabling enhanced chip functionality and higher integration density. Furthermore, the reduction in lead spacing facilitates the miniaturization of packages, meeting the growing demand for portable and space-efficient solutions across various applications.   Through its dedicated efforts to address these industry demands, Haesung DS successfully developed the Super Fine Pitch QFP tooling, laying the groundwork for its strategic entry into the Fine Pitch QFP market.   Haesung DS highlighted that the technological achievement marks as breakthrough in responding to the rising global demand for fine pitch technologies, particularly in key market such as Japan.   “This ILP 110㎛ super-fine pitch technology represents a core innovation for accessing new markets.” A representative of Haesung DS remarked, “We are committed to expanding our product supply to global customers , enhancing our comptetitiveness in high-value markets, and leading the future of semiconductor package solutions.” * ILP(Inner Lead Pitch) : A technical term referring to the space between leads that connect the chip and package substrate. As the ILP decreases, the number of leads that can be accommodated within a package increases, enabling greater functionality and higher integration density of IC chips.  

calendar_month2024.12.09

Haesung DS Achieves “A” Rating in 2024 ESG Evaluation by KCGS

NEWS

Haesung DS Achieves “A” Rating in 2024 ESG Evaluation by KCGS

Haesung DS, a leading package substrate manufacturer, announced that it has received an A rating in the 2024 ESG evaluation conducted by the Korea Institute of Corporate Governance and Sustainability (KCGS). The achievement reflects the company’s commitment to promoting environmental responsibility and social value through its sustainable management efforts.   KCGS, a prominent ESG evaluation institution in South Korea, annually assesses companies overall sustainability management in the areas of Environmental(E), Social(S), and Governance(G) performance. The ESG evaluation serves as a key indicator to measure how effectively a company implements practices related to environmental protection, social responsibility, and transparent governance.   Since 2017, Haesung DS has consistently maintained the “A” rating in the ESG evaluation with only one exception(2022). This accomplishment ins attributed to the company’s continuous efforts to enhance internal processes and implement environmentally friendly policies while advancing social value across all sectors. As a result, Haseung DS has distinguished itself within the industry for its strong ESG performance.   One of the driving factors behind Haesung DS’s emphasis on ESG activities is its focus on fostering strong partnerships with global clients. With 99% of its revenue generated fr|om exports, and a significant portion derived fr|om European customers with stringent ESG requirements, Haesung DS has made substantial investments in ESG initiatives. Haesung DS is also actively preparing for upcoming regulations such as the Corporate Sustainability Due Diligence Directive (CSDDD) and the European Sustainability Reporting Standards (ESRS) through various proactive measures.   As part of its ESG efforts, Haesung DS recently participated in a collaborative project to eradicate invasive plant species affecting local river ecosystem. The company aims to preserve the natural environmental of local communities and deliver positive impacts through such initiatives.   “We are honored to be recognized for our ongoing efforts in environmental and social responsibility through the “A” rating in ESG evaluation.” The representative of Haesung DS stated, “Moving forward, we will continue to engage with diverse stakeholders and fulfill our corporate responsibility to contribute to a sustainable society.”

calendar_month2024.12.09

Haesung DS, established a partnership with World Share to support schools in Philippine

NEWS

Haesung DS, established a partnership with World Share to support schools in Philippine

Haesung DS Co., Ltd. (CEO Cho Byung-Hak), a subsidiary of Haesung Group located in the South Korea, has signed a memorandum of understanding (MOU) with the international relief and development NGO World Share to support schools in the Philippines.   The signing ceremony, held on November 14 at the office of the Department of Social Welfare and Development (DSWD Region 3) in Central Philippines, was attended by Haesung DS headquarters and its Philippine subsidiary, World Share’s Philippine branch, and DSWD Region 3 officials. Under the agreement, Haesung DS and World Share will each provide annual funding of 10 million KRW to improve school facilities and support children in need. This year, the initiative includes the provision of school supplies and daily necessities to students at Sitio Target Integrated School and the improvement of water sanitation facilities at Calumpang Elementary School.   Since 2016, Haesung DS has collaborated with World Share to assist underprivileged children in Thailand, the Philippines, Indonesia, and Malaysia. Last year, the company also contributed to emergency relief efforts following the earthquake in Türkiye. This school support project is part of Haesung DS’s community engagement efforts in partnership with its Philippine subsidiary, established in 2022. The supported schools and regions were selected through discussions with DSWD Region 3.   The regional Director of DSWD Region 3 welcomed the expansion of support fr|om Zambales to Pampanga province. She stated, “It is highly meaningful that Haesung DS, which has operations in the Philippines, is partnering to support children in this region. We look forward to continued collaboration in the future.”   The general Manager of Haesung DS Philippines affirmed, “Following the headquarters’ spirit of service and sharing, we will spare no effort to support local schools and children. We will actively work with the Philippine government and World Share to carry out meaningful initiatives.”   The executive Director of World Share expressed gratitude, saying, “We deeply appreciate Haesung DS for joining us in efforts to support children in the Philippines. We will continue working together to reach more children in need.”  

calendar_month2024.12.09

Haesung DS Publishes Its first “2023 Sustainability Report”

NEWS

Haesung DS Publishes Its first “2023 Sustainability Report”

  Advancing Toward a Sustainable Future Through ESG Management   Semiconductor package substrate manufacturer Haesung DS (195870, CEO Byung-Hak Cho) has released its inaugural 2023 Sustainability Report, detailing key achievements and goals in environmental, social, and governance (ESG) areas.   This report, based on the company’s first double materiality assessment, outlines Haesung DS’s ESG vision, “Sustainable Partner for the Environment, People, and the Future.” It presents strategies and actions aimed at promoting sustainable growth while addressing stakeholder concerns.   In the environmental sector, Haesung DS is working toward carbon neutrality by 2050. The company aims to increase the reuse rate of its total water withdrawal to 50% and achieve a 100% recycling rate for manufacturing waste by 2030. With ISO14001 certification and regular environmental audits, it continues to improve its sustainability efforts.   In the social sector, Haesung DS is fostering a safe and inclusive workplace by operating whistleblowing systems and harassment prevention centers. The company has obtained ISO45001 safety certification and strengthens risk prevention through regular safety training and supply chain assessments.   In the governance sector, Haesung DS has established a transparent management system, with its board overseeing strategy, performance, and risks. Ethical management is supported by an independent audit team and cyber audit office.   “Through this report, we aim to transparently share our ESG progress and plans, contributing to a sustainable society.” The representative of Haesung DS stated, “We will continue to engage with stakeholders and strengthen our commitment to sustainability.”  

calendar_month2024.12.09

NXP Semiconductors Announces Best Supplier Awards

NEWS

NXP Semiconductors Announces Best Supplier Awards

AUSTIN, Texas, May 19, 2016 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ:NXPI) has announced the winners of its annual Supplier Awards at the company’s first Supplier Day following NXP’s merger with Freescale. Senior executives fr|om 80 of NXP’s key suppliers were in attendance representing all spend areas (Materials, Equipment, Foundry services, Subcon services and Indirect services). The event was hosted by Rick Clemmer, NXP’s President and CEO, and the theme was ‘Partnering for Growth’.    A photo accompanying this announcement is available at http://www.globenewswire.com/NewsRoom/AttachmentNg/4646eeae-79b2-45df-be16-977f4e036d97   “We know that partnering with the right suppliers is a crucial element that allows us to better execute on our growth strategy,” said Rick Clemmer. “It is great to see the excitement this week at both the Supplier Day event, recognizing our foremost suppliers, as well as at the NXP FTF User Conference where we showcased the breadth and depth of our applications. These events are important as they help us engage with our key customers, suppliers and partners, as well as with industry-leading decision-makers, government officials and influencers, collectively advancing the debate on how we can further enable and accelerate future Secure Connections for a Smarter World solutions.”   Next to the Secure Connections for a Smarter World strategy, NXP senior executives also spoke at the Supplier Day event about the company’s growth plans for its different businesses, and delivered key insights into end customer markets. They reiterated the need for strong collaboration with our supply base focusing on uncompromising quality, flexible capacity, cost competitiveness and value engineering as key enablers to aid in NXP’s further growth.   As a recognition of superior performance, NXP presented awards to suppliers across the key spend categories.   Best Supplier – Front-end materials: Air Liquide, industrial and electronics speciality gases service provider Best Supplier – Front-end equipment: Busch Semiconductor Vacuum Group LLC, semiconductor equipment Best Supplier – Foundry services: Taiwan Semiconductor Manufacturing Company Limited, full-service semiconductor foundry Best Supplier – Back-end materials: Haesung DS, leadframes for semiconductor packaging Best Supplier – Back-end equipment: DISCO Corporation, manufacturer of precision cutting, grinding, polishing and tooling equipment Best Supplier – Subcon services: Ardentec, automated test services for the semiconductor industry Best Supplier – Indirect services: TATA Consultancy Services, IT Services   Technology and continued innovation are very critical drivers of NXP’s success. In recognition of the co-development in strategic nodes to support our smart card and NFC business, the Best Supplier –Technology award was presented to GLOBALFOUNDRIES.   “The markets we serve demand the highest levels of Quality. The new NXP’s increasingly integrated applications mean we need to continue to raise the bar on quality, and we are asking our suppliers to have a ‘Quality First’ culture they live by”, emphasized David Reed, NXP’s executive vice president of Technology & Operations. A Quality Award was presented to the best supplier across all the spend categories.    Best Supplier – Quality: Soitec, silicon wafer manufacturer   In addition to the corporate supplier awards, NXP also acknowledged five Account Managers with ‘Customer Advocate’ awards in recognition of their dedication and commitment to drive collaboration between NXP and their respective companies.   “NXP is poised to grow at a 1.5x relative market share in the markets we compete in. We view our suppliers as an extremely important part of our growth journey to support us with quality, capacity, cost performance and technology collaboration. We look forward to further strengthening our joint efforts in line with NXP key expectations as outlined in today’s event,” said Jacky McNulty, NXP’s senior vice president and chief procurement officer.   About NXP Semiconductors   NXP Semiconductors N.V. (NASDAQ:NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries, and posted revenue of $6.1 billion in 2015. Find out more at www.nxp.com.     Global Joon Knapen Tel: +49 151 257 43 299 Email: joon.knapen@nxp.com  Europe  Martijn van der Linden Tel: +31 6 10914896 Email: martijn.van.der.linden@nxp.com Greater China / Asia  Esther Chang Tel: +886 2 8170 9990 Email: esther.chang@nxp.com

calendar_month2024.12.09

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