On July 12, Haesung DS held a groundbreaking ceremony to expand its production plant for lead frames and packaging substrates, which are core semiconductor components, at its Changwon plant.

In March, Haesung DS signed an investment agreement of about 350 billion won with Gyeongsangnam-do and Changwon Special City, and plans to expand its production base, including high-tech facilities, with the aim of mass-producing in the second half of 2024.

Haesung DS's main products, lead frames and packaging substrates, are essential parts for making semiconductor substrates, and they connect semiconductor chips and main substrates to deliver electrical signals and power and support chips. In particular, Haesung DS has established a solid position in memory package substrates, including automotive semiconductors, with its own technology and manufacturing method, and has achieved the third-largest market share in the global lead frame market in 2021.

Through this investment, Haesung DS said it will actively respond to the growing demand for automotive semiconductors such as electric vehicles and self-driving cars, strengthen the competitiveness of fast-growing memory package substrates, and also hire more than 300 local talent to create jobs.