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Overview

Package Substrate

Package substrate is the widely used substrate that
connects semiconductor memory chips
and external circuits board.

Applications

Flash Memory
Mobile DRAM
Graphic DRAM
3Layer FBGA for Mobile DRAM
2Layer FBGA for Flash Memory
4/6Layer FBGA for Graphic DRAM
FcFBGA for DDR3/DDR4

Key features

  • Unique Reel to Reel process for high productivity.
  • Substrates for Flip-chip and wire bonding.
  • 3 / 4 / 6Layer substrates for flash memory, mobile DRAM and high speed memory.
  • Thinner substrate less than 0.1mm thick and better warpage control.

Product Line-up

unit : um

PKG type FBGA FC-FBGA BOC
PCB Thickness
(Min./um)
2 layer 80 200 170
3 layer 80 - -
4 layer 135 240 -
6 layer 240 240 -
Finger Pitch
(Min.)
T : 70(40/15) T : 60(20/20) T : 90(40/20)
M : 65(40/15) M : 55(20/20) M : 90(45/20)
Trace
(typ.)
T : 25/25 T : 25/25 T : 25/25
M : 20/20 M : 20/20 M : 20/20
SR Material Ink, DFSR Ink, DFSR Ink, DFSR
Pad Finish Au/Ni, OSP Au/Ni, OSP Au/Ni, OSP
SR Registration (um) ±10 (UV DI) ±25 (A/W 4D) ±25 (A/W 4D)
SRO (Ink / DFSR) ±10 ±15 ±15

*Specifications are subject to change without notice
Etch back, selective OSP available