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For the past 30 years, HAESUNG DS has grown with the semi-conductor industry with our in-depth
experience and core technology obtained from the development and manufacturing of Lead Frame and
Package Substrates, both essential components for semi-conductor packaging processes.
We have spun off from SAMSUNG TECHWIN in 2014, and was reborn by being incorporated into HAESUNG
With the advent of the Digital Transformation age, HAESUNG DS promises to offer unparalleled values to
our customers through endless technological innovation in diverse areas such as IoT, Big Data, and AI.
HAESUNG DS will strive continuously to grow together
with our customers and become a Global Top Tier Micro
Device Solution Provider.
We would like to ask for your continued support for
HAESUNG DS and look forward to working together.